• Single (multi) crystalline silicon ultra-pure water quality standards, technology, applications


  • 一、Overview
     Silicon is the most abundant on earth one of the materials stored, from the 19th century, scientists have found a crystalline silicon semiconductor properties, it would change everything, even human thought. Until the last century 60's, to replace the original silicon germanium material. Silicon Materials - because of its high temperature and radiation performance is better, especially suitable for production of high-power devices become the most widely used features of a semiconductor material, currently most of the integrated circuit semiconductor device silicon material.
     Now, everywhere in our lives, "silicon"figure and role of crystalline silicon solar cells is the formation of the past 15 years the fastest growing industry.
     Melting of elemental silicon in the solidification of silicon atoms arranged in diamond lattice in many nuclei, if these nuclei grow into the same crystal plane orientation of grains, these grains have crystallized into a parallel combination of silicon.
      Method for making silicon is usually obtained first polysilicon or amorphous silicon, and then use the Czochralski or floating zone melting rod grown from the silicon melt. Silicon rods of raw materials to produce silicon wafer, with the domestic and international market demand for silicon wafer rapid increase in demand for silicon rods also showed rapid growth trend.
     According to their diameter, silicon wafer is divided into 6 inches, 8 inches, 12 inches (300 mm) and 18 inches (450 mm) and so on. The larger the wafer diameter, the more integrated circuits can engraving, the lower the cost of the chip. But the large-size chip on the materials and technology requirements are also higher. Silicon crystal growth by different methods, divided into Czochralski (CZ), zone melting method (FZ) and extension of the law. Czochralski method, zone melting growth of silicon rods, silicon thin film epitaxial growth method. Czochralski growth of silicon is mainly used for semiconductor integrated circuits, diodes, epitaxial wafer substrate, solar cells. At present the crystal diameter can be controlled in Φ3 ~ 8 inches. Single crystals by zone melting method is mainly used for high voltage high power field controlled rectifier is widely used in power transmission, electric locomotive, rectifier, inverter, mechatronics, energy saving lamps, television sets and other products. At present the crystal diameter can be controlled in Φ3 ~ 6 inches. Wafer is mainly used for integrated circuits.

      Due to cost and performance reasons, Czochralski (CZ) silicon material most widely used. In the IC industry, the materials used are mainly CZ polished and epitaxial wafers. CZ polished wafers commonly used memory circuits, due to lower costs. Logic circuits typically use a higher wafer prices, because in the IC manufacturing has better applicability and has the ability to eliminate Latch-up.
     Silicon, also known as silicon, the electronic information materials, the most basic materials, is a class of semiconductor materials. Silicon has penetrated into the national economy and national defense science and technology fields, more than 200 billion U.S. dollars in today's global electronic communications semiconductor market, more than 95% and 99% of semiconductor devices with silicon integrated circuits.
     Polysilicon is composed of many silicon atoms and a combination of many small grains of silicon crystals. The orientation of each grain as different from each other, in which a large number of defects. Polysilicon generally dark silver-gray, opaque, with metallic luster, brittle, at room temperature is not lively.

      Polysilicon is silicon metal (silicon) by chemical reaction, purification, and then reduction with high-purity materials (also known as reduction of silicon). The world's polysilicon production methods are modified Siemens (SiHCl3), a new silane (SiH4), SiH2Cl2 thermal decomposition, SiCl4 law polysilicon production process.
     The current global polysilicon market conditions are: from the international point of view, a few years ago is still in oversupply of polysilicon, in 2004, the solar energy industry, solar energy use polysilicon shortage, leading to global polysilicon supply. In China, China's long-term polysilicon production can not meet the needs of the domestic market, heavily dependent on imports.

     Monocrystalline silicon ultra-pure water equipment water quality standards

      Monocrystalline silicon ultra-pure water equipment, water quality in full compliance with the U.S. ASTM water quality standards, China's electronics industry technical standards for electronic-grade water (18MΩ.cm, 15MΩ.cm, 10MΩ.cm, 2MΩ.cm, 0.5MΩ.cm five Standard), China's Ministry of Electronics Industry trial of high water quality standards, the U.S. semiconductor industry pure water indicators, integrated water quality standards in Japan, domestic and international large scale integrated circuit water quality standards.
     New optical materials production, processing, cleaning; LCD liquid crystal display, PDP plasma display, high quality lamp tubes, micro-electronics industry, FPC / PCB circuit boards, circuit boards, large-scale, ultra-large scale integrated circuits requires large amounts of High water, ultrapure water to wash semi-finished products. The higher integration of integrated circuits, the higher the water quality requirements, which also ultrapure water treatment technology and products, simplicity, automation, continuity, sustainability and so made ​​more stringent requirements.

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